Cheng-Ying Lee
National Tsing Hua University, Taiwan
Biography
Cheng-Ying Lee majors in materials science engineering at national tsing hua university and specializes in thermal management. At the early stage of her research work was raising the thermal conductivity of diamond/Cu Composites as heat spreader. In recent days, she focuses developing using low melting point alloy as thermal interface material to increase thermal transfer efficiency. She expects her research result will be more competitive than current commercial products
Abstract
Abstract : Fabrication of high thermal conductive diamond/copper composites and their joining with substrates